Low dielectric coverlay bonding sheet
Low dielectric constant, low dielectric loss tangent coverlay, bonding sheet. It is a material suitable for high-frequency design.
The low dielectric coverlay bonding sheet is a material compatible with low dielectric constant, low dielectric loss tangent coverlay, and high-frequency design. Due to its low Dk and Df, it contributes to reducing dielectric loss in transmission lines, and its low Dk allows for wider circuit conductors, enhancing the flexibility of wiring design. It can be press-formed at 160°C, eliminating the need for changes in auxiliary materials due to high-temperature pressing (above 160°C). It can be molded using the current coverlay press equipment. For more details, please contact us or refer to the catalog. We have developed an ultra-low dielectric and ultra-dielectric loss tangent adhesive sheet. For more details, please contact us.
- Company：ニッカン工業
- Price：Other
